MEMS 132: MEMS Packaging
The course focuses on microelectronic integrated circuit (IC) and chip-on-board packaging. The student will be introduced to common packaging techniques and equipment used in the industry such as epoxy die attach, thermosonic wire bonding of 0.001” diameter wire, encapsulation, and microscope metrology.
- Date:
- 2022-08
- Primary Material Type:
- Instructor and/or Advisor/Case Manager Support Materials
- Institution:
- Lorain County Community College
- Subjects:
- MEMS - Micro-Electromechanical Systems
Industry / Occupation
- Industry Sector:
- Manufacturing -- Electrical Equipment, Appliance, and Component Manufacturing (335)
- Occupation:
- Production Occupations -- Numerical Tool and Process Control Programmers (51-4012)
Education / Instructional Information
- Instructional Program:
- Engineering Technologies/Technicians (15)
- Credential Type:
-
- Certificate
- Credential
- Stacked/Latticed Credential Model
- Associate Degree
- Bachelors Degree
- Program Delivery Format:
- Face-to-face
Copyright / Licensing