MEMS 132: MEMS Packaging

The course focuses on microelectronic integrated circuit (IC) and chip-on-board packaging. The student will be introduced to common packaging techniques and equipment used in the industry such as epoxy die attach, thermosonic wire bonding of 0.001” diameter wire, encapsulation, and microscope metrology.
Microsoft Word MEMS 132_ MEMS PACKAGING.docx (45 KB)
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Date:
2022-08
Primary Material Type:
Instructor and/or Advisor/Case Manager Support Materials
Institution:
Lorain County Community College
Subjects:
MEMS - Micro-Electromechanical Systems

Industry / Occupation

Industry Sector:
Manufacturing -- Electrical Equipment, Appliance, and Component Manufacturing (335)
Occupation:
Production Occupations -- Numerical Tool and Process Control Programmers (51-4012)

Education / Instructional Information

Instructional Program:
Engineering Technologies/Technicians (15)
Credit Type:
  • Credit
Credential Type:
  • Certificate
  • Credential
  • Stacked/Latticed Credential Model
  • Associate Degree
  • Bachelors Degree
Program Delivery Format:
Face-to-face

Copyright / Licensing

Primary License:
Creative Commons License
This work is licensed under a Creative Commons Attribution 4.0 International License.
 

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